Circuit Design Software for Hybrid / MCM / LTCC

EPD’s LTCC Design Tool is now complete CAD and CAM

As Ceramic Hybrid and MCM designs move into the future and requirements for ever-changing design features and manufacturing and assembly processes continue to grow, don't struggle with yesterday’s tools when you can receive the benefits of a truly flexible open-architecture ceramic design layout solution with full Computer Aided Manufacturing (CAM) output, Design-For-Manufacture (DFM) with 3D visualization and checking.

The Only Unlimited Hybrid/MCM Circuit Design System

Thin film, thick film, co-fired (LTCC, HTCC) ceramic Hybrid/MCM designs are no longer a headache, but a fast and easy process when using Electronics Packaging Designer (EPD). Utilize our powerful Layout Versus Schematic (LVS) design system that ensures that the design layout matches the schematic at all times. Also, insure proper clearances with our configurable Design Rule Checking (DRC). Realize die creation from any input, as well as an attach pattern fan-out generator with many unique features. Parametric and graphical building of through hole, surface mount, intelligent printed and etched elements, and thick film resistors in various shapes are standard.

In addition to the parametric and graphic building of through hole, surface mount, intelligent printed and etched elements, and resistors in various shapes standards, use a choice of positive fill, negative fill, positive boundary, and mixed plane/routing with extension commands for coplanar ground shields and automatic via peppering. Take advantage of via creation for through hole, blind/buried holes, LTCC, hybrid and MMIC technologies. Construct all dimensioning directly and within multiple layout-views for assembly drawings, fabrication drawings, bonding diagrams and more. Generate artwork with utilities for RS274D and RS274X, GDSII, true type font support, true arc support, polygon fill support, etc.

Key Features Include:

Design using any type of Ceramic MCM technology

• All types of Ceramic Packages supported; LTCC, HTCC, Thick Film and Thin Film, with new technologies being implemented.
• Manufacturing processes are built into the software.
• Circuits and components may be equally built up on both sides of a thick or thin film hybrid substrate or LTCC dielectric.
• Any number of layers is possible on either side of a substrate on a Thick Film Ceramic Hybrid.

Contact us to receive your free circuit design consultation for Hybrid/MCM/LTCC design software.