IC Packaging Circuit Design Software
IC Packaging Technology contains many tools that have been developed in direct response to the needs of the world’s largest silicon and packaging companies. Our unique bondfinger fanout generators are capable of creating infinite variations using many customized templates and allow full manual control of every setting.
Flip Chip / Die Bump Technology automates the process of creating redistribution routing and bump artwork to convert a standard die to a flipchip die. The redistribution layer can be easily and quickly created directly on the IC through the use of our automated bump creation and interactive autorouting utilities.
Lead Frame Technology fully automates and intelligizes all types of Lead Frame designs, including TQFP, TSOP, SOIC, MQFP, and PLCC. Automatic fanout types include Vpattern, Curved and Vpattern/Curved. High speed lead frames may be exported as a full 3D model to numerous simulation software tools for accurate performance analysis.
Stacked Die Technology includes support for all stacked die constructions, including stacked die multi-chip modules. Multiple routing technologies such as side routing are included, as well as the combination of multiple connection technologies, including wirebonds, lead frames, die bump, etc.
PoP (Package-on-Package) Technology combines multiple packages or circuit boards into the same database to allow full system continuity and design rule checks, and allows the stacked packages to be separated for fabrication.
Contact us to receive your free circuit design consultation for IC Packaging design software.
