Press Releases, Trade Shows, White Papers, and News

Press Releases

March 5, 2009 Press Release - DuPont Joint Press Release: DuPont Microcircuit Materials and CAD Design Software Integrate LTCC Materials and Processes in CDS Ceramic Design Software to Speed Design - Download PDF
July 9, 2008 Press Release � CADParts & Consulting signs VAR Agreement with CAD Design Software: CDS announces new partnership with CADParts & Consuling - Download PDF
June 2, 2008 Press Release � Major Breakthrough in Ceramic Design Software: CDS announces rapid reduction in LTCC process time by major customer - Download PDF
April 30, 2007 Press Release � New Software Version: CDS announces the release of Version 7.6 - Download PDF

SEMICON WEST Jul. 14-16, 2009, San Francisco, CA: See us at booth 848, south hall
http://www.semiconwest.org/index.htm
IWLPC (International Wafer-level Packaging Conference) October 27-30, 2009, Santa Clara, CA: http://www.iwlpc.com
IMAPS 2009 Nov. 1-5, 2009, San Jose, CA: http://www.imaps.org/imaps2009/index.htm

*Trade Shows at which CDS will be presenting.

"Can Current EDA Packaging Tools Meet the Demands of Ever-changing 3D Packaging Technologies?": Presented at the IMAPS 5th International Conference and Exhibition on Device Packaging, March 2009
"LTCC Materials, Guidelines, and CAM and Test Output Integration for Electronic Design Automation (EDA)": Presented at IMAPS 2008, November 2008
"Facing the Challenges of Cost Efficient Design for HF/RF Boards - Overview and Outlook on Today's Technologies": Presented at Semicon Europa April 2006
"Bond Wire Yield Rate Optimization on SiP in a 3D Design Environment": Presented at the 2nd International Conference and Exhibition on Device Packaging March 2006
"Hybrid/MCM Design, Coming of Age": Presented at the IMAPS UK Hybrid/MCM conference December, 2005