Press Releases, Trade Shows, White Papers, and News
Press Releases
- March 5, 2009 Press Release - DuPont Joint Press Release
- DuPont Microcircuit Materials and CAD Design Software Integrate LTCC Materials and Processes in CDS Ceramic Design Software to Speed Design - Download PDF
- July 9, 2008 Press Release – CADParts & Consulting signs VAR Agreement with CAD Design Software
- CDS announces new partnership with CADParts & Consuling - Download PDF
- June 2, 2008 Press Release – Major Breakthrough in Ceramic Design Software
- CDS announces rapid reduction in LTCC process time by major customer - Download PDF
- April 30, 2007 Press Release – New Software Version
- CDS announces the release of Version 7.6 - Download PDF
CDS Trade Shows
2009 Scheduled Shows
- IWLPC (International Wafer-level Packaging Conference) October 27-30, 2009, Santa Clara, CA
- http://www.iwlpc.com
- IMAPS 2009 Nov. 1-5, 2009, San Jose, CA
- http://www.imaps.org/imaps2009/index.htm
*Trade Shows at which CDS will be presenting.
CAD Design Software - White Papers
- "Can Current EDA Packaging Tools Meet the Demands of Ever-changing 3D Packaging Technologies?"
- Presented at the IMAPS 5th International Conference and Exhibition on Device Packaging, March 2009
- "LTCC Materials, Guidelines, and CAM and Test Output Integration for Electronic Design Automation (EDA)"
- Presented at IMAPS 2008, November 2008
- "Facing the Challenges of Cost Efficient Design for HF/RF Boards - Overview and Outlook on Today's Technologies"
- Presented at Semicon Europa April 2006
- "Bond Wire Yield Rate Optimization on SiP in a 3D Design Environment"
- Presented at the 2nd International Conference and Exhibition on Device Packaging March 2006
- "Hybrid/MCM Design, Coming of Age"
- Presented at the IMAPS UK Hybrid/MCM conference December, 2005
