Awards

• July 2005 - CDS RECEIVES PRESTIGIOUS AWARD FROM ADVANCED PACKAGING MAGAZINE, which each year awards the semiconductor packaging industry’s most innovative companies with a prestigious recognition of excellence for electronic packaging applications.  CAD Design Software's Bond Wire Optimizer/3D Design won in the CAD Package Design Software & Equipment category
  (Article and announcement) 
  (Official list of winners)
  
  

• September 2002 - "Top 10 Developments" in Ceramic Interconnect Technology Announced at IMAPS 2002 Washington, DC – The latest advances and challenges – “The Top Ten Developments in Ceramic Interconnect Technology” – were recognized at a recent press event hosted by the Ceramic Interconnect Initiative (CII) at IMAPS 2002, The 35th International Symposium on Microelectronics in Denver, Colorado. CAD-Design Software's "Hybrid Designer” has been nominated for the honor of being included in the Ceramic Interconnect Initiative's "Top 10 Ceramic Accomplishments for 2002". 
  (See official Press Release)