Hybrid/MCM Design,
Coming of Age
Presented at the IMAPS UK Hybrid/MCM conference entitled,
"THE THICK AND THIN OF CERAMICS BASED
INTERCONNECTION", held December 1, 2005 in London UK at
Greenwich University.
MAR. 2006
Bond Wire Yield Rate Optimization on SiP in a 3D Design Environment Presented at the 2nd International Conference and Exhibition on Device Packaging
APR. 2006
Facing the Challenges of Cost Efficient Design for HF/RF Boards - Overview and Outlook on Today's Technologies
Presented at Semicon Europa 2006
