Currently in: News>Press
Releases>December 04, 2006
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Press Release –
New Software Version
CDS announces the release of Version 7.5.
CAD Design Software releases the latest version of their
leading-edge circuit layout tools for the IC packaging,
RF/Microwave, Hybrid/MCM, and PCB layout industries, incorporating
advanced interoperability capabilities.
December 4, 2006, San Jose, Calif.—CAD Design Software announces
the release of the latest version of their advanced layout tools.
Version 7.5 is the culmination of extensive collaborative
relationships with many industry leaders in the U.S., Japan, and
Asia in the Semiconductor Packaging, Hybrid/MCM, IC Test, and
RF/Microwave fields.
“Through working closely with top industry leaders, we’ve been
able to rapidly implement new layout solutions for emerging
technologies as well as created new output and routing tools for IC
packaging, IC Test, RF, and MCM layout”, said Gordon Jensen,
president of CAD Design Software.
More robust, sophisticated algorithms and new data optimization
result in faster processing, and new customer-requested functions
improve overall time-to-market, and verifiably improve yields.
CAD Design Software‘s Version 7.5 is unsurpassed in features,
functions, and most of all, flexibility. CAD Design Software leads
the EDA industry with the most rapid development and implementation
of new tools for emerging high-end new technologies for its
customers. This has resulted in many industry firsts, including
Stacked Die, 3D design, automated IC package routing, co-development
and design-for-manufacture (DFM) platforms.
About CAD Design Software:
CAD Design Software provides complete 3D Electronic Design
Automation solutions for semiconductor packaging and PCB designs
disciplines using Electronics Packaging Designer (EPD) software
suites for applications such as BGA, mBGA,
Hybrid/MCM, Lead Frame, Stacked Die, IC Test, RF/Microwave, Flex and
other design technologies.
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