KEY FEATURE DEMONSTRATIONS Enter here to view special function demonstrations that show how easy our EDA software handles the most tedious tasks.

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3D Design Technology automatically generates ACIS compatible solids from designs done with CAD Design Software. 

It also generates voids to display holes and cavities and creates 3D bondwires from stored profiles in blocked attach patterns.

Key Features Include:

1. Easy to use controls and mostly automatic
   
   

2. Automatic Setup from pre-configured stackup data set in the Hispeed command or an optional manual override
   
   

3. Uses custom bondwire profiles that can be differently assigned to each wire
   
   

4. Many 3D viewing and rendering options built in
   
   

5. ACIS compatible option so 3D files can be sent to Solidworks and other ACIS compatible programs
   
   

6. Stores and reads back stackup data files

These 2 Graphics were created with CDS's 3D Technology. Textures and renderings done with another 3D graphic design software

• Makes voids where holes go through pads and vias

• Makes voids in cavities on either side of the substrate

• Automatically adds 3D solder balls to BGAs

• Allows manual control of elevation and thickness of each entity

• Extrudes traces, pads and components to make a 3D view of the layout

• ACIS compatible option so 3D files can be sent to Solidworks and other ACIS compatible programs

• Automatic Setup from pre-configured stackup data set in the Hispeed command or an optional manual override

• Uses custom bondwire profiles that can be differently assigned to each wire

• Stores and reads back stackup data files

• Many 3D viewing and rendering options built in

• Puts plating inside PCB holes

• Each component has an editable height that is a built in attribute