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This module extrudes the 2D outlines of components, substrates, cavities and holes and wires to make 3D shapes. It automatically generates ACIS compatible solids including voids, holes and boundaries from a design done with CAD Design Software. It is automatically configured from thicknesses stored in the material stack-up section of the Technology system. It makes 3D models of bond wires by combining a side view profile (unlimited numbers of profiles can be made) with the top view of the wires.

It extrudes along the custom Bond Wire profiles to make any shape 3D bond wires. It extrudes holes and then subtracts them from the substrates, traces, pads, planes etc. To make a full 3D model of an entire design once a 3D model is made the advanced rendering options in AutoCAD can be used to generate realistic images or simple wireframes. It can then be exported to ACIS or STEP to transfer a 3D model into a thermal or electrical analysis tool.

Also See 3D Lead Frame

Key Features Include:

1. Easy to use controls and mostly automatic.
    

2. Automatic Setup from pre-configured stackup data set in the Hispeed command or an optional manual override.
    

3. Uses custom bondwire profiles that can be differently assigned to each wire.
    

4. Many 3D viewing and rendering options built in.
   
   

5. ACIS compatible option so 3D files can be sent to Solidworks and other ACIS compatible programs.
   
   

6. Stores and reads back stackup data files.

These 2 Graphics were created with CDS's 3D Technology. Textures and renderings done with another 3D graphic design software

• Makes voids where holes go through pads and vias.

• Makes voids in cavities on either side of the substrate.

• Automatically adds 3D solder balls to BGAs.

• Allows manual control of elevation and thickness of each entity.

• Extrudes traces, pads and components to make a 3D view of the layout.

• ACIS compatible option so 3D files can be sent to Solidworks and other ACIS compatible programs.

• Automatic Setup from pre-configured stackup data set in the Hispeed command or an optional manual override.

• Uses custom bondwire profiles that can be differently assigned to each wire.

• Stores and reads back stackup data files.

• Many 3D viewing and rendering options built in.

• Puts plating inside PCB holes.

• Each component has an editable height that is a built in attribute.