Software Add-On Utility:
Advanced MCM
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The Advanced MCM Software Utility is part of our Master Foundry Designer
Suite.
Get Advanced MCM and other
related tools when you purchase this suite.
This product may be added
to these Master Design Suites:
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Being challenged to
design a multi-source, multi-tier Stacked Die MCM with complex
bondwire fanouts?
Plus produce the
final result in 3D?
Advanced MCM (AMCM),
a software design tool from CAD Design Software, is a breakthrough
EDA software technology. AMCM is a new system for the design of
advanced package solutions. It has the capability to design the most
complex stacked die constructions easily and quickly. The system
supports insertion of an unlimited quantity of dies in the same
package for multi-sourcing. It also allows a designer to account for multiple sourcing
of dies, multiple revisions of a product, and multiple products in a
single substrate layout.
Because the system is written in an advanced, high-speed code, it is capable of
processing thousands of bondwires in just seconds. This kind of
innovation will result in tremendous time savings in design cycles,
feasibility studies, and in general packaging substrate design. In
addition, companies can now focus more time on optimizing and
refining new products and less time on actual design.
AMCM supports an advanced
wirebond design capability for creation of any kind of wirebonds,
including reverse wirebonds, die-to-die wires, etc.
AMCM supports all major
technologies, including multi-chip packages, flip-chip, stacked
packages, etc. Other features include automatic uncross and sorting
features, easily editable configuration models, use of stackup
conditions to easily analyze different configurations, and detailed
reporting functions on all parameters and wirebond conditions.
Advanced
MCM was developed in cooperation with industry leading companies.
The result is a software tool that is now being implemented and used
by some of the biggest semiconductor companies in the world. The
system is a cost effective solution that reduces the design time of
complex packages from days to only a matter of hours.
Key
Features Include:
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Any number of dies allowed in
a die stack
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Alternate sources for each
die may be configured
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Multiple designs may be made
on a single substrate
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Automatic uncrossing of wires
on the same level
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In depth editing capability
on all entities
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Developed in cooperation with
one of the world's largest semiconductor manufacturers
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Dies can be created using multiple sources:
X,Y coordinate file
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Analysis of graphical information, such as that from a DWG or DXF file
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Reads directly from an Excel file
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Advanced Conditions control allows rapid
editing.4 different fanout types for Chipscale Packaging.
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Components may be added or removed at any
time.
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It can handle multiple rows and columns of tack points on a single
SBP.
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It can handle unlimited numbers of dies and conditions to handle unlimited alternate dies and multiple products on the same
substrate.
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Ability to use over 100 dies in a single database.
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Use of multiple stackup conditions to create different die
configurations.
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Ability to read in different netlists and information files for use in the design.
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Many different bondwire fanouts are available.
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Ability to create a component after different configurations are
explored.
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Accurate placement of completed module.
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Powerful editing features to modify the module after it is
created.
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Automatically uncross many bond wires coming from the same die in seconds.
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Advanced display features allow viewing of all entity and sub-entity data.
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Set colors to bondwires for easy viewing.
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