Software Modules Overview

Software Modules
Some modules are included in the Master Designer and Designer Suites or may be purchased as an add-on module to a Designer Suite.

3D Designer (3D) – This module extrudes the 2D outlines of components, substrates, cavities and holes and wires to make 3D shapes.
BGA Documentation (BGAD) – Automatically generates semiconductor packaging documentation by creating complex cross sections with dimensions, tables of information, wire bonding diagrams, and other detailed fabrication and assembly diagrams.
BGA Rebuild (BGAR) – This module semi-automatically processes any DXF or AutoCAD® data from roughly drawn line work into a fully intelligent drawing in the EPD format that can have any EPD process run on it.
Custom Software (CUST) – CDS will modify its software or write new software to solve special problems or to smooth your design flow.
Design Rule Checker Light (DRCL) – This module is a 2D clearance checker that shares most of its features with Design Rule Checker Pro, except it is limited to standard EPD entities and non-hierarchical rules.
Design Rule Checker Pro (DRCP) – This module checks all entities, standard and custom for 2D clearance errors. Different clearances may be set between any pair of entity types.
Die Bump Designer (Flip Chip) (DBD) – This module provides the necessary software to redistribute the I/O on the die to an array of bumps in preparation to mounting the die on a BGA substrate as a flip chip.
Flex (FLX) – This module has programs that support automatic trace filleting, cover layer generation, advanced arc editing, special flex tapers and other advanced flex circuit features.
High Speed (HSP) – This software makes electrical calculations based on information in the Package, PCB or Hybrid layout for each net: resistance, capacitance, inductance, propagation delay. It extracts and exports data for use by the Cadence Allegro® Shape-Based Autorouter.
Hybrid Embedded Passives (HYB) – Advanced parametric commands create embedded / laser tunable resistors, capacitors, inductors, multi-tiered cavities and other special components.
Inter-Active Autorouter (IAR) – Inter-Active Autorouter automates the routing process of ball-grid array substrates and other tight PCBs. It contains powerful features to streamline the routing process of dense BGA, CSP, PCB and Hybrid / MCM designs.
Lead Frame Base (LFB) – This software contains the base EPD that is capable of designing and checking complex PCBs. Lead frames are seen as multi-layer PCBs with boundary nets and sloping vias. It also contains a complete tool set for designing QFP Lead Frames in a semi-automatic process.
Lead Frame Intelligizer (LFI) – This software intelligizes any Lead Frame design so that advanced functions available in EPD may be used including sending into Cadence SIP for co-design.
Lead Frame Editor, Parametric (LFEP) – This software works on an intelligent lead frame and automatically makes it a parametrically editable model. It can make hundreds of changes in just minutes.
Lead Frame Library Search (LFLS) – This software maintains large libraries of intelligized Lead Frame and provides a search function that helps the designer find the best available Lead Frame for his die.
Micro BGA Module (µBGA) – This module has custom designed programs that optimize the design of the Tessera Micro BGA custom leads.
Micro QFN Generator (µQFN) – This parametric dialog driven tool automatically makes unlimited variations of Micro QFN type Lead Frames with complex patterns of internal leads just by typing numbers into the multi tab dialog box.
Phased Array Antenna (PAA) – This software facilitates the semiautomatic and automatic tuning of phased array antennas. It has a system to keep track of all the path lengths in the antenna system’s routing and various tuning commands that tune the entire path at once.
Package on Package (POP) – This module combines multiple packages or circuit boards into the same database to allow full system continuity and design rule checks, and allows the stacked packages to be separated for fabrication.
Quad Flat Pack No-Lead Generator (QFN) – This parametric dialog driven tool automatically makes unlimited variations of QFN type lead frames with complex patterns of internal leads just by typing numbers into the multi tab dialog box.