Do you ever wish your EDA vendor knew how to do a design layout?

TOOLS DESIGNED BY PCB DESIGNERS FOR PCB DESIGNERS 

All technologies developed by CDS for EPD, our Electronic Packaging Designer System, are based on real world needs rather than what a programmer thinks you need…and command sets follow the order of the design procedure.

Master PCB Designer

Master IC Test Designer

Master Foundry Designer

The Design Technologies listed below are either included in one or all of our Master Design Suites. Pick a Technology below to read more detailed information:

• PCB Technology is the heart of all EPD Master Designer systems. Most parts are parametrically created in dialog boxes and stored for easy retrieval. Inserted parametric parts may be edited at any time with their creation programs by picking them on the screen.
  
  

• RF / Microwave Technology provides tools that enhances the design of RF / Microwave / Wireless printed circuit boards. A full library of RF components automate the creation of complex embedded circuits with dividers, couplers, spiral inductors, radial stubs, etc. 
  
  

• Hybrid MCM Technology supports designs for all types of Ceramic technologies. A dedicated hybrid library allows a user to save die geometries as bare dies or as part of intelligent bondwire fanouts. 
  
  

• IC Packaging Technology contains many tools that have been developed in direct response to the needs of the world’s largest silicon and packaging companies. Our unique bondfinger fanout generators are capable of creating infinite variations using many customized templates and allows full manual control of every setting. 
  
  

• Stacked Die Technology includes support for stacked package constructions. Two separate packages or circuit boards can be combined in the same database to allow full system continuity and design rule checks. 
  
  

• Flip Chip / Die Bump Technology automates the process of creating redistribution routing and bump artwork to convert a standard die to a flipchip die. The redistribution layer can be created easily and quickly directly on the IC through the use of our automated bump creation and interactive autorouting utilities.  
  
  

• Lead Frame Technology fully automates all types of Lead Frame designs, including TQFP, TSOP, SOIC, MQFP, and PLCC. Automatic fanout types include Vpattern, Curved and Vpattern/Curved. 
  
  

• Load Board Technology provides tools to automate the design and documentation of all Device Under Test (DUT) Load Boards. Netlists are quickly converted or created using powerful wizards. A special system graphically allocates tester resources to DUT pins. 
  
  

• Probe Card Technology is a specialized set of tools designed to automate all Probe Card / Interface Card designs for Automatic Test Equipment. The system provides many utilities to save time in resource assignment and routing of the circuit board. 
  
  

• Burn-In Board Technology features hierarchical controls in both schematic and layout to facilitate the design of cell-based board constructions. The system can check the design for electrical continuity at the cell level and at the board level.
  
  

• Flex Technology provides tools to speed up the design of flexible printed circuits. The program easily handles true arcs in trace routing, in teardrops, in DRC and when outputting Gerber files.
  
  

• Liquid Crystal Technology automates the design of LCD type layouts. PCB/AutoCAD is an ideal place to design LCDs since any shape geometry is supported with full net capture and design rule checking capabilities.
  
  

• Auto Schematic Capture Technology is capable of quickly laying out schematic diagrams and outputting netlists to most popular formats. Auto Schematic Capture is included with CDS Master Designer Suites™ or as Stand-Alone software for use directly Inside AutoCAD® or Microsoft Windows™.
  
  

• Micro BGA (µBGA) Technology automates the process of designing Tessera® Chipscale Packages. Die creation tools easily allow a user to read die information from various sources, such as text files, spreadsheets, CAD drawings.