KEY FEATURE DEMONSTRATIONS Enter here to view special function demonstrations that show how easy our EDA software handles the most tedious tasks.

No more using 3rd party tools to complete documentation

Complete documentation quickly and automatically in the design instead of resorting to manual document creation in 3rd party software.

CAD Design Software's Packaging Documentation automatically generates semiconductor packaging documentation by creating complex cross sections with dimensions, tables of information, wire bonding diagrams, and other detailed fabrication diagrams. Documentation is completed in a matter of a few minutes and is saved with the design.

Key Features Include:

1. Configurable automatic data tables with dozens of information fields to choose from
   
   

2. Automatic wirebond diagrams including multiple diagrams for optional dies configuration
   
   

3. Extracts any view of a design into a new data file
   
   

4. Automatically draws BGA outline installation diagrams
   
   

5. Converts two ways between tables in the drawing and Excel files
   
   

6. Automatically labels bonding pads with Net and / or BGA pin data at any angle

Command List:

• BallLabel - Labels BGAs with row and column text.

• BGAlist - Draws a list of connections for a selected net.

• BGAspec - Draws a BGA outline installation drawing from user defined parameters.

• BGAtable - Draws die attach and BGA information in a table.

• BondLabel - Labels substrate bondpads with Ball pin numbers or Net names.

• CrossSec - Creates dimensioned cross section of a multiple substrate laminate structure.

• DrillInfo - Examines a drawing for holes and creates a report.

• Dwg2XL - Creates MS Excel files from tables made with the BGA Table or other commands.

• ExtView - Extracts what ever is on the screen to a new drawing from any block structure.

• MextView - Extracts multiple views to individual files using the LX batches and direct layer selection.

• OrthoV - Draws diagrams of BGAs or PGAs with top, bottom and side views.

• PinLabel - Places the pin numbers from a selected component to a specified distance.

• ReadBW - Reads in a text file of bondwire coordinate positions and draws them.

• Reptable - Powerful report table generator of Packages and Test PCBs.

• TestData - Makes BGA testdata in an ASCII text format.

• WireBond - Outputs bondwire coordinate information.

• XL2Dwg - Makes a table from an Excel file

Features full capability for dimensioning and tolerancing for the most advanced fabrication documentation needs. 

Supports fully automatic creation of assembly and fabrication drawings, complete with drill tables and charts.