KEY FEATURE DEMONSTRATIONS Enter here to view special function demonstrations that show how easy our EDA software handles the most tedious tasks.

The IC Packaging Design Technology is part of our Master Foundry Suite.  Master Foundry Designer Get IC Packaging and other IC Packaging related tools when you purchase this suite. See a demonstration on various features of IC Packaging design capabilities  IC Demo Main Ball Grid Array Attach Pattern  Dogbone Vias Routing,Teardrop,Filleting  Ground Plane  SolderMasks

IC Packaging Solutions, Not Work-  Arounds, for all IC Packages Types

CDS's IC Packaging Software, Used by Many of the Worlds Largest Silicon and Packaging Companies, Supports all Package Types including Laminate BGA, Flex BGA, Chip Scale BGA, Enhanced or Cavity BGA, Wafer Scale BGA, etc. 

Our unique bondfinger fanout generators are capable of creating infinite variations using many customized templates and allows full manual control of every setting.

Also included are Manufacturing products for BGA CAM (used for the automatic creation of BGA strips) and BGA Rebuild (used for rebuilding intelligent designs from existing designs from unintelligent sources, such as DXF or Gerber.

Key Features Include:

1. Bond-finger / bond-wire fanout uses parametric controls for unlimited creative flexibility
   
   

2. Flip Chip or wirebond die placement
   
   

3. Automatic creation of JEDEC or custom BGAs including reading in an MS Excel^® file with Netnames and Class names initialized
   
   

4. Automatic and interactive Netlist Creation tools for single chips and MCMs
   
   

5. Any angle autorouter with built in push function has interactive options
   
   

6. Auto BGA Strip panelizing verifies plating lead shorting

• Support for all package types including new technologies BGA, MCM, CSP, BUM, WSP, etc.
• Six ways to read in die information for automatic die creation

  • Reads .LIQ files

  • Reads .DIE files

  • Reads .DWG files

  • Reads GDSII Stream files

  • Digital scans from photographs 

  • Manual data entry

• Automatic power rings with automatic signal name assignment from netlist or from die

• Automatic Dogbone Array creation with option for a 2 via stair step on each Ball and many angle options
• Automatic, any angle pre-route fanout from bondfingers to first row of BGA balls
• Push and shove editing of adjacent traces at any angle
• Auto trace spreading and thickening
• Auto net verification (LVS) with die pad checking and net highlighting
• Auto plating lead generator and checker
• Automatic solder mask generator for bondfinger and balls

• Netlist generation is automatic or interactive or customer supplied

• Bonding fiducials parametrically generated

• Parametric Mold Gate generation

• Individual editing size and angle of single or multiple Dogbones made easy

• Routing and route editing tools are refined for use on BGA packages

• Fiducials for wirebonding and die placement are parametrically generated

• 3D checking of bondwires at tolerance conditions

• Optimal wire bonding yield through