KEY FEATURE DEMONSTRATIONS Enter here to view special function demonstrations that show how easy our EDA software handles the most tedious tasks.

The Lead Frame Design Technology is part of our Master Foundry Suite.  Master Foundry Designer Get Lead Frame and other IC Packaging related tools when you purchase this suite.

Design Technology: Lead Frame

Leadframe Fanouts with Incredible Accuracy and Unlimited Flexibility

Leadframe fully automates all types of Leadframe designs, including TQFP, TSOP, SOIC, MQFP, and PLCC. Automatic fanout types include Vpattern, Curved and Vpattern/Curved. Leadframe Designer easily creates difficult fanout geometries quickly and accurately, including Gate and Vent geometries. Designs can be automatically routed from Bonding Tips to Leads with variable Trace widths. User can manually route using powerful and variable width routing tools. 

Boundaries can be automatically generated from the intelligent non-boundary data. Complete DRC and MRC ensures that the leadframe meets all custom design rules before being sent to manufacturing. Intelligize an existing design, place a new die, and automatically create bondwires with or without a net list.

Key Features Include:

1. Using our Attach Command, a die is selected and parametric controls are set to automatically generate standard lead frames or power lead frames with power rings.
   
   

2. Using the LFIntel command Lines or polylines drawn using AutoCAD tools may be intelligized and then the die can be placed with automatic bondwire generation with or without a net list
   
   

3. Using our LeadTips command, sections of Leadtips may be parametrically generated and joined to make a complete leadframe.
   
   

4. Full DRC, connection verification netlist generation and manufacturing rules checking
   
   

5. Our ReplDie program replaces dies in existing designs or places them in new designs. It even does stacked dies in a leadframe
   
   

6. Automatic Boundary edge generator provides for chemical milling with etch compensation

Lead Tips may be created by 3 different methods.

1. Using our Attach Command, a die is selected and parametric controls are set to automatically generate standard lead frames or power lead frames with power rings.

2. Using the LFIntel command Lines or polylines drawn using AutoCAD tools may be intelligized and then the die can be placed with automatic bondwire generation with or without a net list

3. Using our LeadTips command (below), sections of Leadtips may be parametrically generated and joined to make a complete leadframe. 

• Outer Leadframe is automatically created after parameters are set

• Powerful automatic and manual leadframe routing tools make the connections

• Full DRC, connection verification netlist generation and manufacturing rules checking

• Our ReplDie program replaces dies in existing designs or places them in new designs. It even does stacked dies in a leadframe

• Automatic Boundary edge generator provides for chemical milling with etch compensation

• Complete bondwire editing utilities

• Automatic filleting tool eliminates sharp corners on the entire design