KEY FEATURE DEMONSTRATIONS Enter here to view special function demonstrations that show how easy our EDA software handles the most tedious tasks.

Master BGA Designer (MBGAD)
PCB+BGA+DRCP+FLX+G2C+ASC+ADR+HSP+EDGE+IRT+CERM+BGAC+BGAR+DBD+GDSIIC+ PDOC+3D+ADOC

IC Packaging Solutions, Not Work-  Arounds, for all IC Packages Types

This software suite supports all types of BGA designs including Wire Bonded, Flip Chip, Flex, and TAB Bonded on any type of substrate: Organic, Ceramic (LTCC) and Flex with any technology configuration. Cavity type designs are supported with cavity up or down, with any numbers of shelves with optional vertical metal on the shelf edges.

It also includes an interactive auto-router that contains a powerful push program that maintains complex clearance rules set in a configurable grid including multiple differential pair gaps.

Any BGA technology not mentioned here is also fully supported. Also provided are two Simulation Links of your choice (SL).

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Key Features Include:

1. Bond-finger / bond-wire fanout uses parametric controls for unlimited creative flexibility
   
   

2. Flip Chip or wirebond die placement
   
   

3. Automatic creation of JEDEC or custom BGAs including reading in an MS Excel^® file with Netnames and Class names initialized
   
   

4. Automatic and interactive Netlist Creation tools for single chips and MCMs
   
   

5. Any angle autorouter with built in push function has interactive options
   
   

6. Auto BGA Strip panelizing verifies plating lead shorting

• Support for all package types including new technologies BGA, MCM, CSP, BUM, WSP, etc.
• Six ways to read in die information for automatic die creation

  • Reads .LIQ files

  • Reads .DIE files

  • Reads .DWG files

  • Reads GDSII Stream files

  • Digital scans from photographs 

  • Manual data entry

• Automatic power rings with automatic signal name assignment from netlist or from die

• Automatic Dogbone Array creation with option for a 2 via stair step on each Ball and many angle options
• Automatic, any angle pre-route fanout from bondfingers to first row of BGA balls
• Push and shove editing of adjacent traces at any angle
• Auto trace spreading and thickening
• Auto net verification (LVS) with die pad checking and net highlighting
• Auto plating lead generator and checker
• Automatic solder mask generator for bondfinger and balls

• Netlist generation is automatic or interactive or customer supplied

• Bonding fiducials parametrically generated

• Parametric Mold Gate generation

• Individual editing size and angle of single or multiple Dogbones made easy

• Routing and route editing tools are refined for use on BGA packages

• Fiducials for wirebonding and die placement are parametrically generated

• 3D checking of bondwires at tolerance conditions

• Optimal wire bonding yield through