KEY FEATURE DEMONSTRATIONS Enter here to view special function demonstrations that show how easy our EDA software handles the most tedious tasks.

Want Relief from Design and Layout Problems? 

That’s exactly what you get when using the EPD Master Foundry Designer from CDS. A seamless work environment for mixed technologies for even the most challenging package designs…and here’s why

Automation of the physical layout utilizing advanced automation techniques makes problems disappear…and many of our users are saving from 40% up to 90% of design time using CDS tools.

• Plastic BGA

• Enhanced/Cavity BGA

• Stacked Die CSP/BGA

• FlexBGA

• mBGA

• ChipScale

• FlipChip

• Leadframe (including high speed leadframe)

• PoP (package on package)

• SiP (system in package)

Your design options are unlimited with the use of our geometry engine, which provides layering, drawing and graphics subroutines, dimensioning, true 3D, and unlimited measurement units, including microns.

CDS's wide range of custom designed tools gives you a design collaboration system that bridges the gap between IC Design, Circuit Layout, Simulation/Analysis, Manufacturing, Assembly and Equipment.

For more details of the many technologies and features included in Master Foundry Designer Suite, select from the technologies or features at the right.

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Stacked Die:

• Infinite complex variations of bondwire design fanouts 
• Support for any number of power rings and bond finger rows 
• Individual bondfinger controls for size, spacing, angles, pullback, etc. 
• All manufacturing rules are verified as the bondwire fanout is being designed 
• Support for multiple die sourcing through advanced configuration options
• More... 
  

IC Packaging:

• Support for BGA, MCM, CSP, BUM, WSP, etc. 

• Five ways to read in die information for automatic die creation. 

• Bond-finger / bond-wire fanout with unlimited creative flexibility. 

• Automatic power rings with automatic signal assignment from netlist. 

• Flip Chip or wirebond die placement. 

• Automatic BGA creation including reading from Excel. 

• Automatic Dogbone Array creation with option for 2 vias per Ball. 

• Automatic and interactive Netlist Creation tools for single chips and MCMs. 

• More..

Leadframe:

• Outer Leadframe is automatically created after parameters are set

• Powerful automatic and manual leadframe routing tools make the connections 

• Full DRC, connection verification and manufacturing rules checking 

• Our ReplDie program replaces dies in existing designs or places them in new designs 

• Boundary edge generator provides for chemical milling with etch compensation 

• More...
  

Hybrid/MCM layout:

• Automatic, parameter-driven pad layout diagrams

• On the fly bare die assembly routing and manipulation

• Support for Laminate, Co-fired Ceramic (including LTCC), Thick Film, and Thin Film constructions

• Hybrid vias with Via Fill, Dielectric openings, and stair stepped configurations

• Dielectric patch crossover options

• More...

Die Bump / Flip Chip:

• BallGrid command makes bump patterns with a configurable number of levels and Shapes for use as bumps

• Automatic net list generation by 3 different methods

• Autorouter designed for dense BGA routing 

• Routing using automatic length tuning and matching 

• Interactive routing using differential pairs 

• Complete netlist verification and DRC 

• More...
  

mBGA:

• Automatic Lead and anchor geometries 

• Global or individual Lead Control 

• Calculate lead slack to guarantee strain relief characteristics 

• Reliability system is built in 

• Automatic BGA Creator 

• Automatic Net List Maker 

• More...
  

PCB layout:

• Large, parametrically controlled parts library through which an infinite number of components can be constructed

• A dedicated suite of utilities allows construction of custom components with any imaginable geometry

• Hierarchical Design Rule Checker (DRC) works in batch mode or in real time

• Advanced routing tools including manual, interactive, and fully automatic modes

• More...

RF layout:

• Powerful boundary based geometry, or “anyshape” nets

• Support for true RF miters and fillets with true arcs

• Manual and automatic features for matched lengths, differential pairs, etc.

• Automatic length tuning and matching 

• More...

Flex layout:

• Automatic and progressive teardrops

• Custom coverlay openings

• Timesaving utilities, such as automatic and progressive trace filleting

• More...

Schematic Design:

• Schematic driven design rules

• Symbols and attributes can be loaded from a database

• Powerful library system for custom symbols Bi-directional schematic links to simulation tools such as ADS and MWO

• More...

Simulation add-on links available:

• Agilent Technologies - Advanced Design System

• Applied Wave Research - Microwave Office

• Sonnet - Sonnet Suite

• Computer Simulation Technology - Microwave Studio

• Applied Simulation Technology - ApSim RLGC

• Ansoft - HFSS, Maxwell, and Turbo Package Analyzer

• More...

Manufacturing and Artwork outputs:

• Automatic soldermask openings

• Automatic silkscreen generation and positioning

• Automatic assembly drawings

• ODB++ output for verification (add-on)

• Automatic equipment outputs to wirebond, pick and place, and epoxy dispense machines (Contact CDS to find out which machines are currently supported)

• True 3D solid creation, with exports to all popular MCAD systems through ACIS, IGES, STEP, DWG, DXF, and 3DS formats

• Powerful Gerber output (274-D and 274-X) direct from the database

• GDS II Stream Files