The Master Lead Frame Suite has Unlimited Accuracy, Flexibility and Support for All Lead Frame Types with analysis functions. This suite supports all aspects of Lead Frame design and documentation including QFP, TSOP, SOIC, MQFP, QFN and PLCC.
Dies may be imported from any source, including .txt, .xls, .aif, .die, .dwg, .dxf, bit maps and document scans. It has a process for the semi-automatic creation of QFP and similar type Lead Frames that have Gull Wing style I/O leads and fully parametric design of QFN type Lead Frames.
This software contains the base EPD that
is capable of designing and checking
complex PCBs. Lead frames are seen as
multi-layer PCBs with boundary nets and
sloping vias. It also contains a
complete tool set for designing QFP Lead
Frames in a semi-automatic process.
Various other tools are available for
modification of Lead Frame designs. It
captures dies from any source and
automatically designs the wire bonding
in any Lead Frame type.
Automatic wire bonding design software that can insert single, stacked and side by side die(s) and automatically wire bond them to any Lead Frame blank using complex rules or with predefined net lists. It intelligizes existing Lead Frame blanks or populated Lead Frames from any source for subsequent processing.
The Advanced DRC software verifies all complex lead frame and wire bonding design rules. After wire bonding you can automatically create a full solid model that can be exported as ACIS or STEP for export to thermal analysis tools.
The Lead Frame Library Search software to filter large libraries of EPD-intelligized Lead Frames and provides a search function for best available Lead Frame for a die (available as an add-on module.)
The Lead Frame Intelligizer module captures the lead tips as it converts legacy unintelligent drawings into intelligent designs compatible with Cadence’s APD and SIP and Ansys HFSS, Q3D and CST Microwave Studio (MWS) analysis tools.
Lead Frame Blanks or entire designs including dies and bond wires
Design Lead frames, Place Die(s) in blanks and add bond wires, Stacked Die(s)- even side by side stack ups, New blank designs – Single & MCM.
Semi-Automatically intelligize the unintelligent metal/leadframe artwork and lead tips. And it uses the ATTINTEL command to intelligize any combination of dies and wires including stacked dies and side by side stacks.
This software intelligizes any Lead Frame design so that advanced functions available in EPD may be used including sending into Cadence SIP for co-design. It is a semi-automatic, yet extremely fast process to turn Lead Frame designs that were manually drawn to the standard CDS data format. LFintel intelligizes the metal/leadframe and AttIntel intelligizes the die and the bond wires. Configuration files made during one intelligization can be saved and re-used to automatically configure similar jobs.
Makes perfect 3D models which can be exported via ACIS or SAT formats to electrical, thermal and mechanical analysis tools.
- One of the most important features of any Electronic Design Automation (EDA) layout system is its 3D architecture. As designs trend toward increased speeds/densities, miniaturization of packages/modules, and integrated components with System-in-Package (SiP) technology, it is increasingly important to verify the package integrity using a modern, 3D-based system.
The NETCHK command provides connection verification and netlist generation. Extract the netlist and optionally compare it to a reference netlist. It reports 28 different error types.
Run the ADRC (Advanced Design Rule Checker) command using complex 2D rules and rules with arrays of settings. This tool provides complete DRC and MRC rules to ensure that the lead frame meets all standard and custom design and manufacturing rules before being sent to manufacturing.
MAKEEDGE is an automatic boundary edge generator that provides graphical data for chemical milling with etch compensation. Boundaries can be automatically generated from the non-boundary geometries or from overlapping boundary geometries.
Simulate new or existing Lead Frames by exporting to various simulation soft wares including ANSYS’s HFSS and Q3D, CST’s MWS, Cadence APD/SIP Virtuoso.
Intelligent lead frames can be modified while maintaining the spacing of surrounding leads by distributing the changes evenly. Using the KNitro® engine to make the calculations, the design can be changed for lead length, width, gaps, pull-backs, adding or removing power bars and much more.
This software works on an intelligent lead frame and automatically makes it a parametrically editable model. It can make hundreds of changes in just minutes. For example, it can change the width of all the internal lead tips by reducing the gap between the leads; it can increase the width of one lead by removing a tiny amount of space from all the gaps on the same side. It has an automatic process which reduces gold wire usage by optimizing the distance from the lead tips to the DAP.
Sections of lead tips may be generated parametrically to follow any shape leading edge and then arrayed or joined to make a complete Lead Frame. The PLACEDIE command can replace dies in existing designs or place them in new designs or intelligized Lead Frame blanks using automatic bond wire generation with or without a net list. It even places stacked dies or side by side stacked dies in a Lead Frame.
- Lead tip creation and array.
- Creation of the DAP, ground ring, tie bars, and external leads.
- Auto-routing of the internal leads between the lead tips and the external leads.
- Creation of the Power bars.
- Placement and wire bonding of the die.
Create a full lead frame with
die and wires based on the inner tips or
Bond pad openings Video Demo:
Automatic Design of New QFN Style Lead Frames Video Demo:
Creating a full QFN-type leadframe using parameters to create many areas that would need accurate values. Quickly update an existing design to modify number of leads, length, offset and much more.
Parametric Lead Frame Tip Creation:
dialog driven tool automatically makes
unlimited variations of QFN type lead
frames with complex patterns of internal
leads just by typing numbers into the
multi tab dialog box. Then the Lead
Frame Base Tool can be used to place the
Die and the Bond Wires.