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Available for Tessera Licensees only.

Micro BGA (mBGA®)

Automate the Process of Designing Tessera® Chip-Scale Packages (CSP®) with Micro BGA (mBGA®)

This module has custom designed programs that optimize the design of the Tessera Micro BGA custom leads. Thermal considerations are taken into account in the calculations that are configured in the modern GUI that given constructive feedback so the software can converge on the best solution.

This software was designed and specified by Tessera® Technology Inc. and was programmed, tested and documented by CAD Design Software.

Key Features Include:

  1. Automatic die creation from many possible sources

    • Spreadsheets

    • .DIE file

    • CAD Drawing

    • DXF file

    • Digital photograph

    • plus more...

  2. Die creation tools allow a user to read die information from text files, spreadsheets and CAD drawings

  3. Advanced parameter based system automatically generates lead geometries using advanced algorithms to optimize slack

  4. Lead and anchor parameters are automatically adjusted either globally or individually

  5. Automatic lead and anchor geometries are optimized for thermal characteristics

  6. Global or individual Lead parameter control for complex dies

 

  • Die creation tools allow a user to read die information from text files, spreadsheets and CAD drawings

  • Advanced parameter based system automatically generates lead geometries using advanced algorithms to optimize slack

  • Tessera default design specifications can be automatically entered and edited

  • Lead and anchor parameters are automatically adjusted either globally or individually

  • Automatic lead and anchor geometries are optimized for thermal characteristics

  • Global or individual Lead parameter control for complex dies

  • Reliability system is built in to the lead generation software

  • Automatic BGA Creator for JEDEC and custom BGAs

  • Automatic Net List Maker or use fixed netlist

  • Manual and Interactive autorouter with any angle routing and auto push capability

  • Push & Shove Route Editing

  • Fully unlimited netlist (LVS) and DRC checking

  • Automatic teardrop and trace corner filleting for flexizing the design

  • Automatic panelizing of individual designs on Filmstrip

  • Automatic ground planes

  • Cadence Allegro® Autorouter compatibility

  • Gerber or GDS II output

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