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Available for Tessera Licensees only.
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Micro BGA (mBGA®)
Automate
the Process of Designing Tessera®
Chip-Scale Packages (CSP®) with Micro BGA (mBGA®)
This module has custom designed programs that optimize the design
of the Tessera Micro BGA custom leads. Thermal considerations are
taken into account in the calculations that are configured in the
modern GUI that given constructive feedback so the software can
converge on the best solution.
This software was designed and specified by
Tessera® Technology Inc. and was
programmed, tested and documented by CAD Design Software.
Key
Features Include:
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Automatic die creation from
many possible sources
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Spreadsheets
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.DIE file
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CAD Drawing
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DXF file
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Digital photograph
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plus more...
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Die
creation tools allow a user to read
die information from text files, spreadsheets and CAD drawings
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Advanced
parameter based system
automatically generates lead geometries using advanced algorithms
to optimize slack
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Lead
and anchor parameters are automatically adjusted either globally or
individually
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Automatic
lead
and anchor geometries are optimized for thermal characteristics
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Global or
individual Lead parameter control for complex dies

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Die
creation tools allow a user to read
die information from text files, spreadsheets and CAD drawings
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Advanced
parameter based system
automatically generates lead geometries using advanced algorithms
to optimize slack
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Tessera default
design specifications can be automatically entered and edited
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Lead
and anchor parameters are automatically adjusted either globally or
individually
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Automatic
lead
and anchor geometries are optimized for thermal characteristics
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Global or
individual Lead parameter control for complex dies
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Reliability
system is built in to the lead generation software
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Automatic BGA
Creator for JEDEC and custom BGAs
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Automatic Net
List Maker or use fixed netlist
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Manual and
Interactive autorouter with any angle routing and auto push
capability
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Push & Shove
Route Editing
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Fully unlimited
netlist (LVS) and DRC checking
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Automatic
teardrop and trace corner filleting for flexizing the design
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Automatic
panelizing of individual designs on Filmstrip
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Automatic
ground planes
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Cadence
Allegro® Autorouter compatibility
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Gerber or
GDS II
output
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