KEY FEATURE DEMONSTRATIONS Enter here to view special function demonstrations that show how easy our EDA software handles the most tedious tasks.

The Stacked Die Design Technology is part of our Master Foundry Suite.  Master Foundry Designer Get IC Packaging and other IC Packaging related tools when you purchase this suite. See a demonstration on various features of Stacked Die design capabilities  Stacked Demo Main Ball Grid Array  Create the Stackups  Dogbone Vias  Routing the Design  Ground Plane  Solder Masks

The Most Advanced in Stacked Die Layout Design, Created For and Used by the World's Leading Semiconductor Manufacturers, with a wide range of tools.

Stacked Die was developed in conjunction with the world's largest semiconductor company for complex stacked die packages and is used by top semiconductor companies worldwide.

Two separate packages or circuit boards can be combined in the same database to allow full system continuity and design rule checks. The system automatically detects the connection points from one package or circuit board to another, allowing for optimization of ratline connections, pin assignments on interface devices (such as the ballgrid array), and manufacturing rules. 

Dies can be captured from GDSII files, drawings or data files. Wirebond fanout design programs support multiple dies simultaneously, including direct die to die connections and the sharing of bondfingers by different dies in the stack. The software can also be used to design a substrate simultaneously for multiple products. Alternate dies may be simultaneously designed into the substrate to support multiple suppliers of similar but different parts for the same product. Many of the tools in this suite have been developed in direct response to the needs of the world’s largest silicon and packaging companies.

Key Features Include:

1. Infinite complex variations of bondwire fanout designs
   
   

2. Support for any number of power rings and bond finger rows
   
   

3. Individual bondfinger controls for size, spacing, angles, pullback, etc.
   
   

4. All manufacturing rules are verified as the bondwire fanout is being designed
   
   

5. Support for multiple die sourcing through advanced configuration options
   
   

6. Automatic offset of bondwires along bonding finger axis to support bond finger sharing
   

• Infinite complex variations of bondwire fanout designs

• Support for any number of power rings and bond finger rows

• Advanced Configuration utilities allow radid complex bonding patterns

• Individual bondfinger controls for size, spacing, angles, pullback, etc.

• All manufacturing rules are verified as the bondwire fanout is being designed

• Support for multiple die sourcing through advanced configuration options

• Easy viewing of any combination of dies during the wirebond creation process

• Support for pad sharing by reading a netlist

• Automatic offset of bondwires along bonding finger axis to support bond finger sharing

• Bondwire length shown in 2D and 3D