• All types of Ceramics supported; Thick Film, Co-Fired, Thin Film, etc...

• Circuits and components may be built up on both sides of a ceramic design

• Intelligent links to wire bonding machines

• Multiple bare die can be connected either by wire or flip chip (direct contact)

• Dielectric layers can be setup for punching out of vias and cavities

• Additional conductive and dielectric paste prints can be incorporated in the design

• Material Library and Editor includes many popular industry standard materials

• 3D creation with custom Bondwire Profiles (see the 3D Module).

• Multiple Print Mask Configuration.

• Enter dielectric constant of the specified material.

• Enter the capacitance of the specified material.

• Progressive Filleting of edges.

• GUI Interface grid style dialog for easy configuration

Video Demo of DMASKS command:

• Die files come from many different sources and EPD has created multiple ways to import the die package information for use in your design through:

  • MS Excel®, AutoCAD® DWG or DXF Data, GDS Data, DIE or LIQ files, Digital Photographs.

  • These methods are:

    • Reading two types of standard data files: .Liq and .Die

    • Converting a non-intelligent die drawing made by our GDSII converter

    • Parametrically input die parameters to create custom dies.

    • Scanning a DIE photograph and capturing the data

    • Analyze unintelligent AutoCAD DWG & DXF drawing artwork and also capture pin numbers and signal text.

    • Import tab-delimited files (created with programs such as Excel) that contain coordinates and die dimensions and convert them to LIQ files

• Multiple row bondwire groups

• Power rings for bondwire connections

• Embed information for bondwire material, diameter, length, angle, etc.

• Wire Diameter and length control

• Assign bondwire profiles for single or multiple stacked die.

• Substrate Bond Pad control

• Die Bonding Pad control

• Built in Bondwire Fanout types

• Real-time DRC checking

• LTCC interconnect technology is available through flexible via creation, which includes support for through hole and blind/buried construction for all technologies.

• Combinations of through hole and blind/buried vias are created as blocks to form stair-stepped vias, tunnel vias (similar to through hole), straight vias, and spiral vias.

• PCB Technology

  • Through Hole

  • Blind/Buried

• Ceramic/MCM Technology

  • Tunnel (Through Hole)

  • Blind/Buried

  • Stair-stepped

  • Spiral

• Printed resistors are created with printed resistive paste (often called ink and rated in Ohms/Square) material in specific length / width ratios. This eliminates the large traditional resistor components.

• Features found in a variety of printed resistors include:

  •  Size calculations are based on design rules, and paste characteristics (Resistance, aspect ratio, Ohms per Square, Watts per Sq mm)

  • Shapes include rectangular, top-hat or right angle (L-shaped)

  • Over-glaze with its required overlap

  • Via Keep Out, Trace Keep-out

  • Processing tolerances before and after firing and trim values and tolerances

  • Multiple Prints may be required to get Desired Ohms / Square

  • Calculation of Geometries is based on Min / Max resistance requirement

  • Wattage capacity is based on material properties and coverage area

  • Output laser trimming information directly to the Laser Trimming machine

  • Netlist intelligence even when Embedded on internal layers

• Ladder Tuning for Larger Resistance

• Automatic generation based on min / max resistance values

• Automatic wattage calculations based on material properties

• Output data directly to laser trimming machine

• Parametric control system for starting Level, number of tiers, shelf X & Y Offset and Curved Radius value

• Assignment of the number of levels deep from either side of the substrate

• Multiple cavity offsets from the defined base cavity for stepped cavity creation

• Assignment of keep out perimeters for vias and traces

• Enable connecting dies to inner layers without vias

•  To enable connecting dies to inner layers without vias the LTCC manufacturing system allows for the design of cavities. The following features are allowed in a cavity.

  • Any number of levels deep from either side of the substrate

  • Multiple offsets from the defined base cavity for stepped cavity creation with shelves

  • Assignment of keep out perimeters for vias and traces

• Automatic CAM Configuration includes:

  • Nibbler Data Auto generation and Machine Compatible Output

  • Output for wire bonding, epoxy dispense and component placement machines

• Gerber Output with:

  • Rotation about any point

  • Equal or Unequal X,Y Scaling

  • Mirroring on any axis, X or Y

  • Punch (drill) Output

  • Four types of Punch Optimizations

  • Panelization